【摘要】 采用非平衡磁控溅射方法在AZ31镁合金表面沉积Mg-Cu-Y薄膜,以纯铜和Mg65Cu25Y10合金作为溅射靶材,选则Mg65Cu25Y10单靶、Mg65Cu25Y10靶和铜靶双靶两种方式分别进行溅射沉积。利用XRD、AFM、SEM分析了膜层结构与表面形貌,纳米压痕法、球盘式摩擦磨损测试研究了膜层的硬度和耐磨性。结果表明,Mg65Cu25Y10单靶溅射得到的薄膜为完全非晶态结构,而双靶共溅获得的膜层中出现含有铜的晶态组织。随着膜层中Cu含量的增加,纳米硬度较非晶态膜层有所降低,但同时耐磨性提高。两类不同结构薄膜相比较,Mg65Cu25Y10单靶溅射沉积的非晶膜层硬度最高,达到12GPa。用磨损量评价了基体与膜层的耐磨性,包含Cu结晶相的双靶共溅薄膜具有较好的耐磨性能。更多还原

【Abstract】 Mg-Cu-Y films were deposited on AZ31 alloy by unbalanced magnetron sputtering.The targets made of pure copper and Mg₆5Cu₂5Y₁0 alloy were adopted.The depositions were carried out by two different modes,that is,deposition by using Mg₆5Cu₂5Y₁0 alloy target alone and co-deposition with Mg₆5Cu₂5Y₁0 alloy target and copper target.The phases of the deposited films were analyzed by glancing incidence X-Ray diffraction（GXRD）.The morphology of the films and the wear traces were observed by atom force microscope（AFM） and scanning electronic microscopy（SEM）,respectively.The hardness of the films was measured by nano-indentation tests.The friction tests were conducted on a ball-disk friction tester.The results show that the structure of the film deposited by Mg₆5Cu₂5Y₁0 is amorphous and no crystalline phase is found.For the films deposited by co-depositition,crystalline copper is detected.The film deposited by Mg₆5Cu₂5Y₁0 exhibits the maximum hardness of 12GPa.The film containing crystalline copper phase deposited by co-depositition shows the better wear resistance.更多还原