【摘要】 研制了一套可应用于MEMS器件的微尺度测量系统,可以在受载状态下实时检测MEMS器件的面内位移、离面位移和三维形貌。该系统中,面内位移测量是一个基于白光数字散斑相关方法的显微光学测量系统,与相应的力学加载系统结合,可以得到MEMS器件在受载状态下的实时面内位移;离面位移和三维形貌测量则是一个基于相移显微投影光栅方法的光学测量系统,与相应的力学加载系统结合,可以得到MEMS器件在受载状态下的实时三维形貌和离面位移。最后给出了几个典型的MEMS器件面内位移、离面位移和三维形貌的实测结果。更多还原

【Abstract】 A micro-scale measurement system applicable to MENS components has been developed. The in-plane displacement, out-of-plane displacement and 3D profile of a loaded MEMS specimen can be measured in real-time with this system. White light digital speckle correlation method is employed in the system in combination with a loading device for in-plane displacement measurement. Phase shifting fringe projection technique is introduced to perform the out-of-plane displacement and 3D profile measurement. When combined with a micro loading device, the system can measure the out-of-plane displacement and the 3D profile of a loaded MEMS specimen in real-time. Finally, several representative experiment results obtained using the developed measurement system are presented.更多还原