【摘要】 随着芯片集成度的不断提高,为CPU提供有效的散热方案成为电子行业的重要研究课题.针对CPU热障问题,着重讨论了热管、微通道和制冷芯片3种新型微冷却方式的发展现状、传热原理以及应用前景,分析了它们各自的优缺点和有待解决的问题,并对这一领域的发展前景作了展望.更多还原

【Abstract】 With the improvements on the chip integration density,providing effective heat removal solutions for CPU is an essential research project in the electronics industry.Taking aim at the problem caused by heat generation of CPU,this paper mainly discussed the current developments,principles of heat transfer and perspective applications of the three novel microcooling methods,including heat pipe,microchannel and cool chip.Advantages and shortcomings of those methods and the relative critical issues were evaluated.Prospect in the chip cooling area was also stated.更多还原