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TDE-85环氧树脂固化动力学的DSC和DMA研究
Study on curing kinetics of TDE-85 epoxy resin by means of DSC and DMA
【摘要】 根据DSC和DMA测试曲线,分别用Kissinger、Flynn-Wall-Ozawa、Friedman-Reich-Levi模型计算了TDE-85/THPA环氧树脂体系的固化动力学参数。Kissering法所得活化能较低,其他几种计算方法所得活化能比较一致,相对误差在10%之内。将Gaussian分布应用于分峰法,计算了每个反应的动力学参数,模拟结果与DSC曲线具有很好的一致性。双峰表明,固化过程包含2个化学反应,缩水甘油脂基的反应活性比脂环基高。利用外推法确定了固化工艺为100℃/6 h+130℃/4 h+160℃/2 h。
【Abstract】 Based on DSC and DMA curves,curing kinetic parameters of TDE-85/THPA epoxy resin system were calculated by means of several thermoanalysis methods,such as Kissinger,Flynn-Wall-Ozawa and Friedman-Reich-Levi.The activation energy calculated by Kissinger equation is the lowest,and the values of activation energy calculated by other methods are close with relative error within ten percent.The Gaussian distribution was applied to the peak separation.Kinetic parameters for each reaction were calculated.The simulation results agree well with DSC curves.Double peaks show that curing process contains two-step reactions.Activity of the glycide group is higher than that of cycloaliphatic epoxy groups.Through extrapolation method,curing process is defined as 100 ℃/6 h+130 ℃/4 h+160 ℃/2 h.
【Key words】 TDE-85 epoxy resin; curing kinetics; DSC; DMA; peak separation;
- 【文献出处】 固体火箭技术 ,Journal of Solid Rocket Technology , 编辑部邮箱 ,2007年03期
- 【分类号】V258
- 【被引频次】60
- 【下载频次】1780