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CMOS兼容的微机械P/N多晶硅热电堆红外探测器
CMOS compatible MEMS P/N polycrystalline silicon thermopile IR detector
【摘要】 提出一种采用正面开口进行湿法腐蚀释放热电堆的结构,通过利用高精度光刻、LPCVD(low-pressure chemical vapor deposition)薄膜生长、IBE(ion beam etching)干法刻蚀、TMAH((CH3)4NOH)腐蚀等微机械加工技术,设计并制作了CMOS兼容的微机械多晶硅热电堆红外探测器。实验得到的器件成品率达到90%以上,响应率为12.5V/W,探测率1×107cmHz1/2/W,为进一步大规模红外面阵研究奠定了基础。
【Abstract】 A structure with specific front cut windows for frontetched releasing was designed.Based on technology such as high precision mask,LPCVD(low-pressure chemical vapor deposition),IBE(ion beam etching) dry etching,TMAH wet etching,a CMOS compatible MEMS polycrystalline silicon thermopile IR detector is designed and fabricated.The experimental thermopile chip yield a product rate of 90%,and it has a measured responsivity of 12.5 V/W and a detectivity of 1×107cmHz1/2/W.It paves a way for researches of large scale IR array.
- 【文献出处】 功能材料与器件学报 ,Journal of Functional Materials and Devices , 编辑部邮箱 ,2007年03期
- 【分类号】TN215
- 【被引频次】11
- 【下载频次】348