【摘要】 以脂肪族二胺、芳香杂环二胺和芳香四羧酸二酐或芳香四羧酸二酐、芳香族二胺为原料,N-甲基吡咯烷酮为溶剂,合成两种聚酰胺酸。逐层涂覆,制备了表面为热可塑聚酰亚胺的三层聚酰亚胺复合膜,与铜箔热压复合制备了双面覆铜挠性印制电路基板。热塑性聚酰亚胺胶的玻璃化转变温度为133℃,三层聚酰亚胺复合膜的结晶熔融温度为222℃。该挠性印制电路基材平均剥离强度为7.1 N/cm。更多还原

【Abstract】 Two kinds of polyamic acids(PAA) were prepared by aliphatic diamine,aromatic diamine and aromatic dianhydride in NMP(N-methyl pyrrolidone).The PAA solution was cast one by one and thermal-imidized.On the basis of this procedure,three-layer polyimide films were prepared with thermoplastic polyimide on the surface layer.Double-sided FCCL(flexible copper clad laminates) was prepared by hot-pressing with copper foils.The results shown for thermoplastic polyimide film,the glass transition temperature is 133 ℃,the crystal melt temperature of threelayer polyimide film is 222 ℃.The mean peel strength of FCCL between polyimide films and copper foils is 7.1 N/cm.更多还原