节点文献
化学镀工艺对Co-B功能膜沉积速率与结构的影响
Effects of technological conditions on deposition rate and structure of functional Co-B films prepared by electroless plating
【摘要】 以硫酸钴为主盐、硼氢化钠为还原剂制备了Co-B合金功能膜。主盐及还原剂的质量浓度增大都会加快沉积速率,但当两者超过一定值时,沉积速率反而下降。pH的增大和温度的升高也会加快沉积速率,而配位剂(酒石酸钠)质量浓度的增大,则会降低沉积速率。X射线衍射实验结果表明,化学镀Co-B合金在镀态下是非晶态。温度升高、主盐质量浓度增大及配位剂质量浓度减小都使镀层有形成晶态的趋势。原子力显微镜(AFM)照片显示:镀层表面由球状突起颗粒构成,颗粒尺寸为0.6~2μm。
【Abstract】 Functional Co-B alloy coatings were prepared on red copper by electroless plating from a CoSO4 solution with NaBH4 as reducing agent. The deposition rate was increased initially and then decreased with increasing mass concentrations of CoSO4 and NaBH4; it was increased with increasing temperature and pH but decreased with increasing mass concentration of complexing agent (sodium tartrate). The results of X-ray diffraction analysis showed that the as-plated Co-B alloy was amorphous. The crystallization tendency was strengthened with increasing mass concentration of CoSO4 and temperature or with decreasing mass concentration of complexing agent. AFM images showed that the coating surface was composed of spherical particles with a size of 0.6 ~ 2 μm.
【Key words】 cobalt-boron alloy; electroless plating; amorphous; structure; deposition rate;
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2007年02期
- 【分类号】TQ153.1
- 【被引频次】1
- 【下载频次】129