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扩散连接Al/Cu/0Cr18Ni9Ti复合材料界面生长机理研究
Study on the Intermetallic Compound and Its Growth of Al/Cu/0Cr18Ni9Ti Diffusion Bonded Joint
【摘要】 采用真空热压扩散连接法制备出冶金结合的钢铜铝复合材料,采用电解腐蚀法对所制备的复合材料从铜侧进行分层腐蚀,并结合扫描电镜(SEM)、能谱分析(EDS)和X射线衍射(XRD)对所腐蚀德连接界面的各个扩散层进行了形貌、成分、相分析。结果表明:铜/铝界面,从铜侧到铝侧以次为铝在铜中的固溶体,CugAl4和CuAl2;不锈钢/铜界面为铜在不锈钢中的固溶体。研究得到了适用于本实验条件下的铝铜金属间化合物生长方式。
【Abstract】 The vacuum warm compaction diffusion method is used to prepare the Al/Cu/0Cr18Ni9Ti composite; electrochemical corrosion is used to gradation etch the Cu and the interface of Al/Cu; and further the scanning electron microscopy(SEM),electron probe microanalysis(EPMA)and X-ray diffractometer(XRD)are used respectively to analyze the gradation etched interface.The following results are obtained: under the condition of two steps diffusion bonding,the composite is well bonded with the joint less than 9μm of intermetallic compound in the Al/Cu joint,1.5μm solid solution formed in the Cu/0Cr18Ni9Ti diffusion zone; through the four stages growth,two kinds of intermetallic compound formed in the interface of Al/Cu,Cu9Al4 adjacent to the Cu side and CuAl2 adjacent to the Al side.The growing model of Al/Cu intermetallic compounds is found suitable for the condition of the experiment by this study.
- 【文献出处】 稀有金属材料与工程 ,Rare Metal Materials and Engineering , 编辑部邮箱 ,2007年S3期
- 【分类号】TB33
- 【被引频次】14
- 【下载频次】341