【摘要】 微电子工业的迅速发展对封装材料的综合性能提出了更为严格的要求。针对封装材料的发展趋势,阐述了以W/Cu作为封装材料所应具备的性能要求及其制备技术,并对其发展方向进行了展望。更多还原

【Abstract】 The development of micro-electronic industry has led to strict claim for the properties of electronic packaging material. According to the new development of packaging material, the demand of characteristics and preparation technology of W/Cu composite material for electronic packaging are expounded in this thesis. And the tendency to develop W/Cu composite material on electronic packaging is reviewed.更多还原