【摘要】 对Sn-3．5Ag-0．7Cu／Ni-P界面上的焊点进行了150℃固相老化和250℃液相回流老化实验,两种条件下焊料体内和界面处金属间化合物的成分、长大速率及形貌均有较大差异,在液相回流条件下金属间化合物长大更快,对焊点的可靠性有较大的影响,延长固相老化时间,焊点内生成大尺寸的Ag₃Sn相；高温液相回流有Ni_sP层生成,降低焊点的焊接强度。更多还原

【Abstract】 150℃ aging and 250℃ reflow aging of Sn-3.5Ag-0.7Cu solder joints on Ni-P/Cu were performed. For two aging processes, the growth, morphologies, compositions of intermetallic compound （IMC） and their effect on joint reliability were studied. The results indicate that the IMC morphologies and compositions under condition of 150℃ aging were much different from that under condition of reflow. Liquidus reflow has more significant effect on the solder reliability due to bigger scale and faster growth of IMC at the interface. Long time aging at 150 °C results in obvious growth of Ag₃Sn in solder. Brittle Ni₃P layer with a negative effect on solder joints reliability was found after high temperature reflow, which was absent at long time aging at 150℃.更多还原