【摘要】 在SoC的测试规划时,考虑为避免在测试过程中出现热点以及测试过程中使热量均匀分布,基于建立的问题模型得到一系列的并行测试集合,再通过Bin-Packing算法构造测试规划,并进行全局的优化.对ITC’02测试用例的实验结果表明,该方法在牺牲一定的测试时间的情况下,有效地控制了在测试时芯片温度的升高,从而避免出现由热量引起的一系列问题.更多还原

【Abstract】 An approach based on Bin-Packing algorithm and graph theory is proposed to avoid the hot-spot and distribute heat evenly on chip surface during test scheduling.First several parallel test set(PTSs) are derived from graph models.Then Bin-Packing algorithm constructs an initial test schedule.A global optimal procedure gets the better test schedule finally.Experiment at results on ITC’02 benchmark SoCs show that this method can effectively avoid hot-spot and distribute heat evenly at the expense of a little percentage of test time.更多还原