【摘要】 研究镁合金基体上进行预处理及电镀Sn、Zn处理后,在190℃进行扩散热处理后的镀层结构。通过XRD、SEM及Darken-Garry理论分析不同热扩散时间后,不同镀层、镀层与镁合金基体之间的微观形貌和相结构的变化。研究表明,镁合金表面镀锌和镀锡后,在190℃处理过程中,锡逐渐扩散至镀锌层内部,并与镁形成了Mg2Sn化合物,锌和镁间并未形成化合物及固溶体。单独镀锡层锡与镁的扩散速度大于Zn/Sn叠层中锡与镁的扩散速度。在保温过程中单镀锌层并未与镁合金发生明显的扩散反应,只是镀锌层结构发生了改变。更多还原

【Abstract】 The micro-morphology and phase structure of Zn/Sn layer electroplated on magnesium alloy substrate by thermal diffusion treatment at 190℃ were investigated with XRD,SEM and Darken-Garry theory.The results show that Sn can diffuse into Zn electroplated layer at 190℃,and form Mg₂Sn compound.It’s not found compound or solid solution of Zn and Mg.The diffusion rate of Sn and Mg in Sn electroplated layer is faster than that of Sn in the Zn/Sn plated multi-layer.During low temperature treatment,the plating Zn layer can not diffuse into magnesium alloy,but the microstructure of the Zn layer can be changed.更多还原