【摘要】 论述了用无接触方法测试大型硅片电阻率均匀性的新方案.回顾了EIT技术的发展与成果,对其基本原理和重建算法在理论上进行了描述,提出可将其应用于微区薄层电阻测试,并就测试细节做了进一步探索,最后就其应用前景作了展望.这一技术与传统的四探针技术相比,不仅在理论上将有相同的分辨率,并且具有快速,不损坏硅片的特点.更多还原

【Abstract】 A new method is described for determining the distribution of resistivity of semiconductor wafers and thin conductingfilms withoutcontact. Thispaperreviews the development and achivementof EIT, introducesthebastc theory of EIT, reconstruction algorithm and proposes that it can be applied to measure micro areas sheet resistivity. Then it in- troduces the detail of the measuremen . The technique offers resolution and accuracy comparable to four-point Probe me- thods and the wafer is not contaminated.更多还原