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超声波探伤技术在MLCC检测中的应用研究

The Application Study of Ultrasonic Defect Detection Technology in MLCC Inspection

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【作者】 肖培义李基森卢艺森陈杰

【Author】 Xiao Pei-yi, Li Ji-sen, Lu Yi-sen, Chen Jie (Guangdong Fenghua Advanced (holding) Co.ltd, Zhaoqing 526020, China)

【机构】 广东风华高新科技股份有限公司广东风华高新科技股份有限公司 肇庆526020肇庆526020

【摘要】 MLCC产品的内部微小缺陷一直是MLCC检测的难点之一,它严重影响到产品的可靠性,却又难以发现。本文对比了超声波探伤法与传统的磨片分析法对MLCC内部微缺陷的检测的结果,发现超声波探伤方法能够更精确地检测出MLCC内部的缺陷,从而分选出不良品,提高MLCC的击穿电压与高压可靠性。

【Abstract】 The slight defect inside MLCC was always one of the big difficulties in MLCC inspection, and it was difficult to be found.The product reliability was seriously affected by it. The result that MLCC inside slight defect detection by ultrasonic equipment and traditional section analysis method was compared, and it is got that ultrasonic defect detection is more efficient than traditional section analysis method and it can greatly improve MLCC voltage resistance property and reliability.

【关键词】 MLCC微缺陷超声波探伤
【Key words】 MLCCSlight DefectUltrasonic Defect Detection
  • 【文献出处】 电子质量 ,Electronics Quality , 编辑部邮箱 ,2006年07期
  • 【分类号】TH878.2
  • 【被引频次】8
  • 【下载频次】225
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