【摘要】 利用化学镀覆技术成功在T iB2颗粒表面均匀化学镀覆铜。透射电子显微镜观察表明:通过严格的镀前预处理工艺的优化设计以增加活化点,对传统镀液配方的调整以降低镀速,能够成功地在T iB2颗粒表面镀覆一层铜,从而增强了其和铜基体之间的界面结合力,为T iB2在复合材料领域之中的应用打下了坚实基础。更多还原

【Abstract】 Because of the wetting property between copper matrix and TiB₂ particles being poor,the technology that produces complex powder TiB₂/Cu through electroless copper plating was researched.Observation of TEM images shows that by optimizing the pretreatment process before electroless plating to increase activated sites,and adjusting the traditional composition of copper electroless plating bath to decrease electroless plating rate,a layer of continuous copper on surface of TiB₂ can be successfully coated.Thus the interfacial adhesion between TiB₂ and copper matrix of the composite coating can be increased.更多还原