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Rapid directional solidification in Sn-Cu lead-free solder

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【Author】 Jun Shen1), Yongchang Liu2), and Houxiu Gao2) 1) College of Mechanical Engineering, Chongqing University, Chongqing 400044, China 2) College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China

【Abstract】 An experimental study on the microstructures of a rapid directionally solidified metallo-eutectic Sn-Cu alloy was carried out. This material is an important alloy that is used as a lead-free solder. The results showed that the kinetic undercooling due to the rapid solidification process led to the formation of a pseudoeutectic zone, whereas the hypereutectic reaction produced the regular lamellar structure in the hypereutectic Sn-1.0Cu alloy. The corresponding arm spacing in the obtained lamellar phases decreased gradually with the increase of the applied cooling rate, which corresponded well with the prediction of a rapid directional solidification model.

【关键词】 lead-free solder； rapid directional solidification； intermetallic compounds (IMCs)； pseudoeutectic；
【Key words】 lead-free solder； rapid directional solidification； intermetallic compounds (IMCs)； pseudoeutectic；
【基金】 This work was financially supported by the National Natural Science Foundation of China (No. 50401003), Fok Ying Tong Education Foundation (No. 104015), and the Natural Science Foundation of Tianjin City (No. 033608811).
  • 【文献出处】 Journal of University of Science and Technology Beijing(English Edition) ,北京科技大学学报(英文版) , 编辑部邮箱 ,2006年04期
  • 【分类号】TG44
  • 【被引频次】4
  • 【下载频次】71
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