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计算机辅助低温陶瓷结合剂热膨胀系数的测定及计算
Computer-aid testing and calcutation of thermal expansion coefficient of low-temperature vitrified bond
【摘要】 通过试验确定合适的低温陶瓷结合剂的氧化物的热膨胀计算系数,用计算机依据经验公式对超硬材料用低温陶瓷结合剂的热膨胀系数进行计算,与实际测定值比较,结果表明:在20~100℃范围内的实测平均值比计算值略低,偏差在8%以内;在20~200℃范围内实测平均值比计算值偏高,误差在10%以内,且随着测定温度升高,测定平均值与计算值的偏差增大,但不同成分测定值与计算值有相近的变化规律。因此计算值可以作为低温陶瓷结合剂实际设计时的参考值。配方研究时,可以采用经验公式用计算机预先计算出结合剂的热膨胀系数,此方法有利于减少配方设计的盲目性及试验次数,缩短新产品的研究开发时间。
【Abstract】 In this paper,thermal expansion coefficient of oxide of low-temperature vitrified bond were determined by experiment.Compared with calculation value by computer according to empirical formula,average thermal expansion coefficients of low-temperature vitrified bond tested by experiment between 20℃ and 100℃ is lower than the calculated value,deviation is within 8%;and testing average value is higher between 20℃ and 200℃,deviation is within 10%.Deviations between testing value and calculation value increase with testing temperature ascending,and have similar regularity of change.So it can be as reference of calculating when designing low-temperature vitrified bond,and this method has advantages of reducing testing times and blind design,shortening new product development period.
【Key words】 Low-temperature vitrified bond; Thermal expansion coefficient; Computer; Calculation;
- 【文献出处】 金刚石与磨料磨具工程 ,Diamond & Abrasives Engineering , 编辑部邮箱 ,2005年06期
- 【分类号】TQ174
- 【被引频次】8
- 【下载频次】317