【摘要】 导电填料是电子产品用导电复合材料的主要组元。为防止银基填料中Ag的迁移及克服镀银铜粉的缺点,作者采用抗坏血酸还原Cu2+和Ag+,直接制备了由平均粒径15μm的片状富Ag固溶体合金粉SAg(Cu)和平均粒径2μm的球形富Cu固溶体合金粉SCu(Ag)组成的Cu-Ag合金混合粉。研究了AgNO3用量、CuSO4浓度、反应温度等对Cu-Ag合金粉抗氧化性和导电性的影响,发现上述因素明显影响Cu-Ag合金粉的性能,制备出在<700℃温度煅烧后不被氧化且导电性能不改变的Cu-Ag合金粉。更多还原

【Abstract】 The conductive is a main component of conductive composite for electronics. In order to prevent the migration of Ag in Ag-base filler and to overcome the shortage of Ag plated Cu powders in use, a new method of preparing Cu-Ag alloy powders for conductive fillers were investigated. In the present paper, the mixed Cu-Ag alloy powders of the flake Cu-Ag alloy powders(Ag-rich solid solution, SAg(Cu) of 15μm in average diameter) and the spherical Cu-Ag alloy powders(Cu-rich solid solution, S Cu (Ag)of 2μm in diameter) were directly prepared by chemical reduction of Cu2+ and Ag+ using ascorbic acid as the reducing agent. The influences of factors, such as the amount of AgNO3, the concentration of CuSO4, the reaction temperature on the oxidation resistance and conductivity of Cu-Ag alloy powders were studied. It was found that the above factors obviously affected the properties of Cu-Ag alloy powders, the Cu-Ag alloy powders prepared under the conductions of 60 ℃,0.2mol/L CuSO4, 0.2mol/L AgNO3, the volume ration of CuSO4 to AgNO3=10:10 remained free from oxidation and unchanged conductivity in<700℃ calcinations.更多还原