【摘要】 芯片之间的调平是保证对准精度的一个重要手段.针对目前微制造领域中常用调平机构的缺点,提出了一种实用的柔性调平机构.该机构具有精度高、速度快、结构紧凑、控制简单等优点.重点对机构的调平原理及其概念设计进行了详细论述.在概念设计中,对机构的总体结构及其关键元件———柔性柱的结构进行了设计与分析;为确定调平机构主要的设计参数,建立了原始尺寸、变形尺寸和应力三个方面的约束条件.利用能量法对柔性柱的柔度进行了理论分析,通过商用有限元软件ANSYS8.0对其进行了仿真,从而验证了柔度公式的正确性.指出了在设计实现中需要解决的若干关键问题.更多还原

【Abstract】 In the process of aligning two wafers, leveling them is a very important means to ensure a high aligning precision. A practical and compliant leveling mechanism to smooth away the faults existing in present leveling mechanisms was proposed in the course of microfabrication. This mechanism has the advantages of the high leveling precision, the short leveling time, the compact mechanical configuration, the simple movement control unit, etc. The leveling principle and its corresponding conceptual design were discussed. In the section of conceptual design, the mechanical configuration and the structure of the key parts (flexure hinge) used in the leveling mechanism were introduced, and restriction conditions were established as well for calculating main design parameters from the following three aspects: the original-dimension restriction, the deformative-dimension restriction and the stress restriction. The elasticity of the key part was calculated employing the energy method, and the simulation of the elasticity using commercial finite element analysis software ANSYS8.0 was carried out, which verifies the former theoretical calculated result. Some key problems to be solved in the design were put forward.更多还原