【摘要】 通过高温高湿加速实验对双芯片叠层封装器件的失效进行了研究,观察到存在塑封料与上层芯片、BT基板与塑封料或贴片胶的界面分层和下层芯片裂纹等失效模式.结合有限元分析对器件内热应力分布进行了计算模拟,分析了芯片裂纹的失效机理,并从材料性能和器件结构角度讨论了改善叠层封装器件可靠性的方法.更多还原

【Abstract】 The failure analysis of a stacked die package under a highly-accelerated temperature and humidity stress test is performed.The different failure modes,delaminations,and die cracks are studied and discussed.By taking advantage of finite element analysis (FEA),the thermal stress distribution in the stack-die package is achieved and the effect of different CTE and die thickness is studied.The simulation results indicate the crack propagation site is in accordance with that of experiment results.Suggestions for alleviating failure in a stacked die package are also obtained by reducing the thermal stress in the package.更多还原