【摘要】 引入介质积木的概念 ,可方便地对三维互连结构作预处理以形成介质积木库 ,从而提高电容提取速度 介质积木库法只需借助工艺描述文件 ,即可处理包括保形介质和非正交互连等复杂结构 数值计算表明 :基于介质积木库的电容提取算法在同等精度下比SpiceLink算法快 30倍以上更多还原

【Abstract】 A novel concept of Building Block of Dielectric is introduced to facilitate preprocessing the 3D interconnect structure and building a library of BBD for fast capacitance extraction With a process description file it can handle complex structure as conformal and non orthogonal wire Numerical results present that the capacitance extraction algorithm based on BBD is at least 30 times faster than SpiceLink without loss of precision更多还原