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电子束蒸发a-Si∶Co薄膜的离子注入改性研究

Study on the ion implantated a-Si∶Co thin films grown by electron-beam-evaporation

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【作者】 马铁英刘焕林陈刚杨宇

【Author】 MA Tie-ying, LIU Huan-lin, CHEN Gang, YANG Yu(Department of Materials science and Engineering,YunnanUniversity, Kunming 650091,China)

【机构】 云南大学材料科学与工程系云南大学材料科学与工程系 云南昆明650091云南昆明650091云南昆明650091

【摘要】 用电子束蒸发技术制备非晶硅薄膜,不同剂量Co离子注入后真空退火改性。X射线衍射法分析了样品的物相变化特征,发现Co离子注入可诱导非晶硅结晶,有一优化注入剂量5×1016ions/cm-2,使晶化Si(111)峰最强。还测量了非晶硅薄膜电阻率,揭示薄膜电阻温度系数随Co离子掺杂浓度和退火温度改变的规律;在退火温度500℃,离子注入量5×1015ions/cm-2条件下,获得TCR系数高达-2.5%的薄膜材料。

【Abstract】 a-Si thin films were prepared by electron-beam-evaporated .We improved them by ion implantation then annealing. the films were characterized by X-ray diffraction. It is found that crystallization of amorphous silicon induced by ion implantation has a optimized dose of 5×1016ions/cm-2, the best annealing temperature with different implanted dose is different. The temperature coefficient of resistance (TCR) has changed with implanted dose from 5×1015ions/cm-2 to 1×1017ions/cm-2 and annealing temperature from 300℃ to 500℃. We attained a optimum TCR -2.5% for the samples implanted Co dose of 5×1015ions/cm-2 and annealing at 500℃.

【关键词】 aSi∶Co薄膜离子注入电阻温度系数
【Key words】 a-Si∶Co filmsion implantationTCR
【基金】 云南省科技厅攻关资助项目(2001GG06)
  • 【文献出处】 功能材料 ,Journal of Functional Materials , 编辑部邮箱 ,2004年05期
  • 【分类号】O484
  • 【被引频次】5
  • 【下载频次】102
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