【摘要】 对超精密加工的硅片的表层完整性的精密控制需要以精、准的检测技术为基础,本文概括性 的分析了用于超精密加工硅片的表面\亚表面损伤检测技术,并从破坏性和非破坏性两个角度对检测方 法的应用和发展进行了论述。更多还原

【Abstract】 The precise measurement is the base of the precisely controlling the silicon wafer surface and subsurface integrity during ultra-precision processing. In this paper, the measuring techniques involved in the assessment of silicon wafer damage have been discussed briefly. Moreover, the application and development of the techniques are presented.更多还原