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铜基表面Ni-Si3N4纳米复合镀工艺研究

Study on the Preparation Technology of Electrodeposited Ni/Nano Si3N4 Composite Coatings on Copper Substrate

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【作者】 王丽琴吴化赵宇

【Author】 WANG Li-qin,WU Hua,ZHAO Yu (Department of Materials Science and Engineering,Changchun University of Technology,Changchun 130012,China)

【机构】 长春工业大学材料科学与工程学院长春工业大学材料科学与工程学院 吉林长春130012吉林长春130012吉林长春130012

【摘要】 在纯铜板上制备了含有纳米Si3N4镍基复合镀层,利用扫描电镜观察镀层表面显微组织。研究了含量、阴极电流密度、pH值、温度、时间、搅拌等主要工艺参数对复合电沉积的影响。并用MM 200磨损试验机检测了所得复合镀层的耐磨性能。结果表明,纳米Si3N4镍基复合镀层成型工艺参数为:电流密度4~10A/dm2,温度30~60℃,pH:3~4,超声波辅助机械搅拌;最佳含量是20g/L。

【Abstract】 Ni-based coatings with nanometer Si3N4 powder were made on pure copper substrate.The microstructure of the coatings was analyzed by scanning electron microscope(SEM).The effects of content,current density,pH,electrolyte temperature,electrolyte time and stirring on composite electrodepositing were studied.Wear resistance was done for the coatings by MM-200 wear tester.The result showed that the optimum technological parameters of Ni-based coatings with nano meter Si3N4 powder were obtained as following : current density 4~10A/dm2,electrolyte temperature 30~60℃,pH value equals to 3~4,ultrasonic accompanied by mechanical stirring;the optimum content of powder in the electrolyte is 20g/L.

【关键词】 复合镀层Ni-Si3N4纳米材料显微硬度
【Key words】 Composite coatingNi-Si3N4Nano materialMicrohardness
  • 【文献出处】 表面技术 ,Surface Technology , 编辑部邮箱 ,2004年01期
  • 【分类号】TG174.44
  • 【被引频次】26
  • 【下载频次】143
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