【摘要】 采用粉末预处理、添加诱导铜粉和还原气氛下熔渗的方法制备了用于电子封装/热沉的钨铜金属基复合材料。对比了不同工艺条件下采用熔渗法制备的钨铜复合材料的显微组织,并讨论了钨粉粒径、添加诱导剂等不同工艺条件对钨铜复合材料组织的影响。实验结果表明,当钨粉粒径为5～9μm,诱导铜粉粒径-500目时,经预烧结与熔渗过程得到的钨铜复合材料具有较高的组织均匀性和相对密度及良好的物理性能。更多还原

【Abstract】 The tungsten-copper metal matrix composites for electronic packaging/heat sink application were prepared by infiltration under reductive atmosphere. The microstructures of W-Cu composites prepared under various process conditions were compared, and the effects of processing conditions, including pretreatment of tungsten powders, addition of inducing copper powders, pressure, particle size of the tungsten powder and inducing copper powder were discussed. The experiment results showed that under the conditions which tungsten powder with particle size of 5～9μm, inducing copper powder with grain size of mesh -500, the W-Cu composites with the properties of high relative density, high uniformly microstructure, can be prepared by tungsten skeleton pre-sintering and infiltration process.更多还原