节点文献
无铅焊锡的研究进展
Progress in Study of Lead-free Solders
【摘要】 随着铅对人类和环境的有害影响被日益关注,寻找含铅焊料的替代合金成为亟待解决的问题。近年来人们已对无钎焊料进行了广泛的研究。概述了目前无铅焊锡的研究进展、研究內容,介绍了几种典型的、有潜力的无铅焊锡的成分、性能,总结了当前存在的几个主要问题。
【Abstract】 The harmful effects of lead on the environment and human health,cdupled with the threat of legislation, have prompted a serious search for lead-free solders. Recently,numerous studies have been published on lead-free solders. This paper reviews these results and introduces the properties and compositions of some kinds of representative lead-free solders. Finally it summarizes some important problems that need to be solved instantly.
【关键词】 无铅焊料;
锡基合金;
成分;
性能;
【Key words】 Lead-free solder; tin-substrate alloy; composition properties;
【Key words】 Lead-free solder; tin-substrate alloy; composition properties;
- 【文献出处】 材料导报 ,Materials Review , 编辑部邮箱 ,2003年08期
- 【分类号】TG422
- 【被引频次】34
- 【下载频次】363