【摘要】 介绍了球形半导体技术的产生、发展、现状以及前景,分析了这项新技术与传统平面集成电路技术的区别,简要讨论了它在MEMS、医学这两个方向上的应用实例。球形半导体技术的核心思想是在直径1mm的单晶硅小球上制作集成电路和其他器件。这项新技术中包括单晶硅球制作、无接触工艺、球形光刻、3DVLSI设计和VLSI堆积五项关键技术。更多还原

【Abstract】 This paper mainly describes the origin, development and future of the ball semiconduc-tor technology, and briefly analyses the differences between ball technology and on chip integratecircuit technology. Two examples in application focus on MEMS and medical according to the re-searching work done by Ball Semiconductor Inc are also discussed here. The main theory of ballsemiconductor technology is to built integrate circuit and other devices on 1-milimeter sphere. Singlecrystallization, no-contact processing, spherical lithography , 3D VLSI design and VLSI by cluster-ing are five key enabling technologies of the ball semiconductor.更多还原