【摘要】 在施加电压为５００Ｖ，连接温度为５１３－７１３ Ｋ的条件下，系统地研究了玻璃与Ｋｏｖａｒ合金电场辅助阳极连接时两者间紧密接触面积扩大过程的动力学．结果表明，玻璃与Ｋｏｖａｒ合金之间紧密接触面积的扩大过程受玻璃的弹性变形或粘性流动控制（取决于连接温度）．低于临界温度（约为６６３Ｋ）时，紧密接触面积扩大过程的激活能约为６７ｋＪ／ｍｏｌ（弹性变形控制），与玻璃电传导的激活能相近；高于该临界温度时，相应的激活能为 １９５ ｋＪ／ｍｏｌ（粘性流动控制）．提出了阳极连接时玻璃与金属紧密接触面积扩大过程的动力学模型更多还原

【Abstract】 The kinetics of enlargement of intimately compacted area has been examined for anodic bonding of Kovar alloy to boroslicate glass at temperature range of 513-713 K under applied constant voltage of 500 V. It was suggested that the enlargement of the intimately contacted area between glass and Kovar alloy is controlled by elastic deformation or viscous flow of the glass depending on the bonding temperature. When the bonding temperature was lower than critical temperature of’ 663 K, the estimated activation energy for the process was about 67 kJ/mol (controlled by elastic deformation), close to that for conductivity of the glass. Whereas, for the temperature higher than 663 K, the corresponding activation energy was 195 kJ/mol (controlled by viscous flow). A kinetics model of the enlargement process of intimately contacted area during the anodic bonding of glass to Kovar alloy is proposed to explain these results.更多还原