【摘要】 目前半导体工业生产中普遍采用的清洗技术是 RCA清洗技术 .文中介绍了一种含表面活性剂和螯合剂的新型半导体清洗剂和清洗技术 .并利用 X射线光电子谱和原子力显微镜等测试方法 ,分别比较了用两种清洗技术清洗过的硅片表面 .测试结果表明 ,它们的去污效果基本相当 .但对硅片表面的粗糙化影响方面 ,新型半导体清洗技术优于标准 RCA清洗技术 .更多还原

【Abstract】 A new semiconductor cleaning technique is reported using the clean detergent containing surfactants and chelates.The cleaning effects with two techniques are compared with each other including the silicon surface chemical composition that is observed with X-ray photoelectron spectra,and the morphology observed with the atomic force microscope.The measurement results show that the new technique as effective as the RCA standard clean technique,while considering the impact of the surface roughness on silicon wafer cleaning,the new technique is more effective than the RCA standard system.Moreover,the two techniques are of the carbon contamination in equal quantity.更多还原