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CVD淀积SiC薄膜SiH4、CH4的分解反应的计算机模拟研究
Computing Simulation of Decomposition of SIH4 and CH4 in SiC Films
【摘要】 采用化学气相淀积 ( CVD)淀积 Si C薄膜中 Si H4、CH4的分解反应方程对 Si H4、CH4的分解产物种属进行数学建模 ,并结合相关热力学数据进行计算机模拟 ,得出 Si H4分解产物中以 Si H2 为最多 ,CH4以 CH2 为最多 ,表明它们在淀积薄膜中是主要因素。
【Abstract】 The decomposing mechanism of SiH 4 and CH 4 in nc SiC film by CVD was discussed.After the reaction equations were determined by collecting previous chemical data, the computing simulation was carried out. The results show that the SiH 2 and CH 2 are main factors in deposition of nc SiC films.
【关键词】 数值模拟;
化学气相淀积;
分解反应;
SiC薄膜;
【Key words】 computing simulation; chemical vapor deposition; decomposing reaction; nc-SiC film;
【Key words】 computing simulation; chemical vapor deposition; decomposing reaction; nc-SiC film;
- 【文献出处】 计算机与现代化 ,COMPUTER AND MODERNIZATION , 编辑部邮箱 ,2000年03期
- 【分类号】TP391.9
- 【被引频次】4
- 【下载频次】96