【摘要】 以单晶α－Ａｌ２Ｏ３陶瓷（蓝宝石）和单晶 Ｃｕ为母材，采用真空扩散焊接获得具有两种不同的界面晶体位向关系的Ｃｕ／Ａｌ２Ｏ３扩散焊接头以及带 Ｎｂ膜中间层的 Ｃｕ／Ｎｂ／Ａｌ２Ｏ３扩散焊接头，研究了界面晶体位向关系对接头断裂能量的影响。结果表明，陶瓷－金属界面的晶体位向关系影响界面粘合功（Ｗａｄ）和断裂过程中金属侧所消耗的塑性变形功（Ｗｐ），从而显著影响接头的断裂能量。界面位向关系为（１００）［０１１］Ｃｕ／／（０００１）［１１２０］Ａｌ２Ｏ３的 Ｃｕ／Ａｌ２Ｏ３接头断裂能量值最低，而具有相同位向关系的带 Ｎｂ膜中间层的 Ｃｕ／Ｎｂ／Ａｌ２Ｏ３接头的断裂能量值则最高。更多还原

【Abstract】 Single crystalline Cu and α-A12O3 (sapphire) with different crystallographic orientation relationships at the interface were diffusion-welded in vacuum with and without a thin film Nb interlayer. Effects of the orientation relationship at the interface on the fracture energy of Cu/A12O3 and Cu/Nb/A12O3 diffusion-bonded joints were studied. Results show that the orientation relationship between Cu and α-A12O3 singe-crystals at the interface remarforbly influences the fracture energy of the metal/ceramic joint by changing both the work of adhesion of the metal-ceramic interface and the dissipated energy caused by plastic deformation of the metal side of the joint. The Cu/A12O3 joints with the orientation relationship (100)[011]cu.// (0001)[1120]Al2O3. have the lowest fracture energy values, while the Cu/Nb/A12O3 joints with the same orientation relationship between Cu and A12O3 are the toughest among the tested joints.更多还原