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基于焊点形态理论的SMT焊点虚拟成形技术及其应用

The Virtual Evolving Technology of SMT Solder Joint and Its Applications Based on Solder Joint Shapes Theory

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【作者】 周德俭潘开林覃匡宇黄春跃

【Author】 Chou Dejian , Pan Kailin , Qin Kuangyu , Huang Chunyue (Dept.of Elecetronic Mechinary and Transporation Engineering,Guilin 541004,China)

【机构】 桂林电子工业学院机电与交通工程系!广西桂林541004

【摘要】 在介绍 SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在 SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法。

【Abstract】 In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design , SMT product assembling process design and assembling quality detecting are demonstrated.

  • 【文献出处】 桂林电子工业学院学报 ,Journal of Guilin Institute of Electronic Technology , 编辑部邮箱 ,2000年04期
  • 【被引频次】6
  • 【下载频次】138
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