【摘要】 用直流磁控溅射法在Ｓｉ（００１） 衬底上制备了以Ｔａ 为缓冲层、含有１５ 周期的Ｎｉ８０Ｆｅ２０（４ｎｍ）／Ｃｕ（６ ｎｍ） 多层膜．样品分别在１５０ ，２５０ ，３５０ ℃进行了真空退火处理．用低角和高角Ｘ 射线衍射法研究了多层膜的微结构．结果表明，所有样品均有较好的［１１１］ 取向，而且随退火温度或时间的增加，［１１１］ 取向程度变得更高．超晶格周期、平均面间距在退火后略有减小，表明多层膜结构在退火后变得更为致密．多层膜界面粗糙度随退火温度或时间的增加而增大，平均相关长度随退火温度或时间的增加而减小，分析认为这是由于Ｎｉ８０Ｆｅ２０／Ｃｕ 界面存在严重的互扩散所导致的．模拟Ｎｉ８０Ｆｅ２０／Ｃｕ 多层膜高角Ｘ 射线衍射谱，发现在Ｎｉ８０Ｆｅ２０／Ｃｕ 界面有非常厚的混合层存在，而且混合层厚度随退火温度或时间的增加而增大．模拟结果还表明，随退火温度或时间的增加，Ｎｉ８０Ｆｅ２０ 层面间距几乎保持不变，Ｃｕ 层面间距则随退火温度的增加而略有减小．更多还原

【Abstract】 Ni80Fe20/Cu]15 multilayers werefabricated by dc magnetron sputtering and annealed at 150 , 250 and 350 ℃,respectively. The structures wereinvestigated by low angle and high angle X ray diffraction.It wasfound that,asthe annealingtemperatureincreases,the[111] preferred orienta tion ofsuperlatticesisimprovedslightly,whilethesuperlattice period,interplane distance,average multilayer coherencelength decrease.Theinterfacialroughnessincreases withtheincreaseofanneal ing temperatureand/orannealingtime,thiscan beattributedtotheinterfacialinterdiffusion.Asig nificantlyintermixinglayerlocatedintheinterlayerregion betweenthe Ni80Fe20 and Cusublayershas been revealed bysimulationofhigh angle X ray diffraction,anditsthicknessincreasesastheanneal ing temperatureorannealingtimeincreases.Thesimulation resultsfurthermoreshowed thatthein terplanedistancesofthe Ni80Fe20layer keepsconstant,andthatthe Culayerdecreasesslightly asthe annealing temperatureincreases.更多还原