【摘要】 用电子探针和扫描电镜研究了铝共晶接触反应钎焊时钎缝界面的形成及其抗电化学腐蚀性能。试验结果表明，在Ａｌ－Ｚｎ共晶接触反应钎焊钎缝中加入Ｃｕ可有效地破坏母材Ａｌ表面的氧化膜，避免Ｚｎ对Ａｌ的溶蚀，并形成润湿性良好的Ａｌ－Ｚｎ－Ｃｕ共晶反应钎缝；钎缝的腐蚀过程是沿晶界进行的。更多还原

【Abstract】 In this paper,some problems about the formation of the brazed seam interface and its electrochemical corrosion resistance properties were investigated by using a scanning electron microscope and an electron probe.The results showed that,if only using Zn as the layer in Al eutectic reaction brazing, the eutectic liquid phase can not make the parent metal wet and can not form a good brazed seam interface and that Zn can cause erosion to Al. It also showed that,if adding Cu between Al and Zn,Cu can take priority of gathering and diffusing in the surface crystal boundary of the parent metal and take the eutectic reaction with Al to form an Al Cu eutectic liquid phase. Furthermore the Al Cu eutectic liquid phase can make the surface Al oxide film rise,move,break and wet,spread on the all brazed seam surface, then Zn can be dissolved into the Al Cu eutectic liquid phase and the Al Zn Cu eutectic liquid phase interface can be gradually formed and wetted, spread on the all Al brazed seam surface as the temperature increases and the time passes. Adding Cu between Al and Zn can effectively destroy the Al oxide film on the parent metal,prevent Zn from corroding Al,make Zn wet and spread on all brazed seam surface and form a good Al Zn Cu eutectic reaction brazed seam surface. While used Cu Zn as the layer,the difference of the electrode potentials between the formed Al Zn Cu eutectic and the parent metal is small. The electrochemical corrosion resistance properties by using Cu Zn as the layer are better than those by using Cu. As the Cu content increases,the electrochemical corrosion resistance properties decrease. The corrosion can take place firstly in the rich Cu zone along the Al crystal boundary in the parent metal.更多还原