节点文献

气态源分子束外延GeSi合金中的低温生长动力学研究

Low Temperature Growth Kinetics of SiGe Alloys by Disilane and Germanium Molecular Beam Epitaxy

  • 推荐 CAJ下载
  • PDF下载
  • 不支持迅雷等下载工具,请取消加速工具后下载。

【作者】 刘学锋刘金平李建平孙殿照孔梅影林兰英

【Author】 Liu Xuefeng, Liu Jinping, Li Jianping, Sun Dianzhao, Kong Meiying, Lin Lanying(Material Center, Institute of Semiconductors, The Chinese Academy of Sciences, Beijing 100083)

【机构】 中国科学院半导体研究所材料中心

【摘要】 用气态源分子束外延(GSMBE)法研究了GexSi1-x合金的低温(≤500℃)生长动力学问题,所使用的源分别是乙硅烷和固态锗.在恒定的乙硅烷流量(4scm)Ge源炉温度(1200℃)下,合金中的Ge组分x随衬底温度的降低而升高;另一方面,当衬底温度(500℃)和乙硅烷流量(4scm)保持恒定时,合金中的Ge组分x最初随Ge源炉温度的升高而增大,当Ge源炉温度升高到一定值以上时,x值不再随Ge源炉温度的升高而增大,而趋向于饱和在0.45附近.基于乙硅烷及H原子在Si原子和Ge原子表面上不同的吸附和脱附过程,我们定性地解释了上述生长动力学现象

【Abstract】 Abstract Low temperature (≤500℃) growth kinetics of SiGe alloys by disilane and germanium molecular beam epitaxy has been studied. It is found that the germanium composition x increases with the decrease of substrate temperature in SiGe layers grown with constant disilane flow rate and fixed germanium cell temperature. On the other hand, in SiGe layers grown at a substrate temperature of 500℃ and a constant disilane flow rate, germanium composition x first increases with germanium cell temperatures, and then saturates at about 0.45 when further increase with germanium cell temperatures. This composition dependence behavior on substrate temperature and germanium cell temperature is different from that of SiGe grown using disilane and germane, which may be explained by the H atoms desorption limited growth kinetics.

【基金】 国家八五攻关项目
  • 【文献出处】 半导体学报 ,CHINESE JOURNAL OF SEMICONDUCTORS , 编辑部邮箱 ,1998年05期
  • 【分类号】TN304.054
  • 【被引频次】1
  • 【下载频次】39
节点文献中: