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GaAs MESFET欧姆接触可靠性研究进展

Study and Progress of GaAs MESFET Ohmic Contact

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【作者】 穆甫臣; 李志国; 郭伟玲; 张万荣; 孙英华; 程尧海; 严永鑫;

【Author】 Mu Fuchen,Li Zhiguo,Guo Weiling,Zhang Wanrong, Sun Yinghua,Cheng Yaohai,Yan Yongxin (Reliability Physics Lab.,Electronic Engineering Department, Beijing Polytechnic University,Beijing 100022)

【机构】 北京工业大学电子工程系可靠性物理室;

【摘要】 报道了n型GaAs上欧姆接触的制备及其可靠性,以及基于欧姆接触退化的GaAsMES-FET的失效分析。结果表明,n型GaAs上欧姆接触的制备已日趋成熟,接触电阻有所减小,表面形貌及热稳定性方面都得到了很大程度的提高,接触材料也日趋丰富,GaAsMESFET的失效分析方法也有明显改进。

【Abstract】 The fabrication and reliability of ohmic contact on n type GaAs and fai lure analysis of GaAs MESFET based on ohmic contact degradation are reported in this paper.The results show that the fabrication of ohmic contact on n type GaAs has deve loped a lot,contact resistance has decreased,surface morphology and thermal reliability have been improved very much,and contact materials have become richer.The method of GaAs MESFET failure analysis has been improved greatly.

【关键词】 GaAs; MESFET; 欧姆接触; 可靠性;
【Key words】 GaAs MESFET Ohmic contact Reliability;
  • 【文献出处】 半导体技术 ,SEMICONDUCTOR TECHNOLOGY , 编辑部邮箱 ,1998年05期
  • 【分类号】TN305.93,TN386
  • 【被引频次】6
  • 【下载频次】163
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