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GaAs MESFET欧姆接触可靠性研究进展
Study and Progress of GaAs MESFET Ohmic Contact
【摘要】 报道了n型GaAs上欧姆接触的制备及其可靠性,以及基于欧姆接触退化的GaAsMES-FET的失效分析。结果表明,n型GaAs上欧姆接触的制备已日趋成熟,接触电阻有所减小,表面形貌及热稳定性方面都得到了很大程度的提高,接触材料也日趋丰富,GaAsMESFET的失效分析方法也有明显改进。
【Abstract】 The fabrication and reliability of ohmic contact on n type GaAs and fai lure analysis of GaAs MESFET based on ohmic contact degradation are reported in this paper.The results show that the fabrication of ohmic contact on n type GaAs has deve loped a lot,contact resistance has decreased,surface morphology and thermal reliability have been improved very much,and contact materials have become richer.The method of GaAs MESFET failure analysis has been improved greatly.
- 【文献出处】 半导体技术 ,SEMICONDUCTOR TECHNOLOGY , 编辑部邮箱 ,1998年05期
- 【分类号】TN305.93,TN386
- 【被引频次】6
- 【下载频次】163