【摘要】 利用扫描俄歇微探针（SAM）和原子力显微镜（AFM）研究了SiO2衬底上在外加直流电场作用下沉积的Au薄膜及Au－Ag复层薄膜的表面形貌、结构变化及电迁移扩散行为。结果表明：①在衬底表面施加水平方向电场辅助沉积制备的Au薄膜其表面显示出平整的椭球形晶粒，并沿外电场方向呈织构取向。与未加电场的热蒸发沉积膜相比，具有较为均匀、有序的表面微观结构。②SiO2表面Au-Ag复层薄膜在直流电场作用下，Au，Ag物种同时向负极方向作走向迁移扩散，这与Au－Ag复层薄膜在Si（111）表面电迁移时Au，Ag分别向两极扩散的特点不同，反映了衬底性质对表面原子电迁移的影响。③Au－Ag复膜在电迁移过程中还发生了表面原子聚集状态的变化，原来沉积排布的细小晶粒在电迁移扩散过程中出现不均匀长大，导致薄膜表面粗糙度显著增加。更多还原

【Abstract】 Surface morphology and electromigration diffusion behavior of Au film and Au-Ag double layered film deposited on SiO2 substrates with and without DC electric fie1d were characterized using atomic force microscope (AFM) and scanning Auger microprobe (SAM). It was observed that the surface grains of Au film deposited on SiO2 with a DC electric field had a smooth klliptical shape and formed an ordered structure,as compared with that of Au film prepared without an e1ectric field,which could be attributed to the textured orientation in grain growth induced by DC electric field. The time evolution of the diffusion front of Au and Ag under the innuence of DC electric field was monitored. As opposed to Au-Ag/si(111 )system,the diffusion of Au and Ag in Au-Ag/SiO2 was directed to cathode side simultaneously,but for the former system,Ag spread to the cathode while Au atoms moved towards anode respectively. This result indicated that the substrate properties affect the electromigration behavior of Au-Ag double layered film.AFM observation of surface structures of Au-Ag double layered films be fore and after electromigration indicated that during migration at rather low substrate temperature,the Au,Ag atoms agglomerated to form larger grains,which result in notable increasing of surface roughness of the film.更多还原