【摘要】 对①Ａｇ粉、Ａｇ＿２Ｏ、片状Ａｇ粉和主晶相为ＰｂＺｎＳｉＯ＿４的玻璃—陶瓷粉及②Ａｇ粉、片状Ａｇ粉、ＣｕＯ和ＣｄＯ固体混合料都用聚乙烯醇缩丁醛─树脂─松油醇有机体系配制成两种可镀Ａｇ端头浆料。烧结温度分别为７８０℃和８７０℃。端电极外观好，无尖峰、沟槽、针孔等缺陷。电镀的片式ＭＬＣ的性能达到ＧＢ、ＩＥＣ有关标准的技术条件。更多还原

【Abstract】 Two platable Ag termination pastes have been formulated by adding polyvinyl butyral-resin-terpineol organic systems to solid mixing materials:(1)Ag powder,Ag2O,Ag flake and glass-ceramic powder having PbZnSiO4as main crystal phase,and;(2)Ag powder,Ag flake,CuO and CdO. The firing temperature are 780℃ and 870℃ respectively.The terminal electrodes have showed fine cosmetics without defects such as peaks,furrows,pinholes and so on. Technical data on chip M LC after plating achieve requirements defined in criteria GB,IEC.更多还原