节点文献
胶接接头无损检测研究进展
Developing Tendency of Nondestructive Testing(NDT)Technology of Adhesive Joints
【摘要】 介绍了胶接接头无损检测技术近年来的发展情况,对超声波、声、应力波等无损检测技术的发展作了概要的阐述。同时对胶接接头的强度检测进行了分析,认为检测中所选用的强度相关参数,应充分体现胶接接头对应力的响应,这样才可能实现胶接强度的定量检测。
【Abstract】 This paper reviews the developing tendency of NDT, including ultrasonic testing,acoustic emission testing and acousto-ultrasonic testing,ect, in recent years. This paper also anlyzes the strengou testing of bonded joints.It is considered that the relafive strength parameter used in the inspection should be dosed to stress responding of adhesive joints,so as to test adhesively bonded strength quantitatively.
【关键词】 无损检测;
胶接接头;
超声波;
声发射;
应力波;
【Key words】 Nondestructive testing(NDT); Adhesive joints; Ultrasonic Acoustic emission Acousto-ultransonic(AU );
【Key words】 Nondestructive testing(NDT); Adhesive joints; Ultrasonic Acoustic emission Acousto-ultransonic(AU );
- 【文献出处】 粘接 ,TECHNOLOGY ON ADHESION & SEALING , 编辑部邮箱 ,1995年04期
- 【分类号】TG494.7
- 【被引频次】11
- 【下载频次】203