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直流磁控溅射(Ti、Al)N硬化膜的研制

A STUDY OF (Ti,Al)N HARD FILMS BY DC MAGNETRON SPUTTERING

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【作者】 袁军丁明清胡汉泉

【Author】 Yuan Jun, Ding Mingqing, Hu Hanquan(Beijing Vacuum Electronics Research Institute)

【机构】 北京真空电子技术研究所北京真空电子技术研究所

【摘要】 本文介绍单靶直流磁控溅射三元复合(Ti,Al)N硬化膜的研制结果。制得的Ti0.5Al0.5N腹具有(111)面择优取向Bl NaCl立方结构,显微硬度达到2700kg/mm2,并具有良好的抗氧化性和抗酸腐蚀性。文中着重讨论了沉膜过强中氮分压、基片负偏压以及基片温度对薄膜显微硬度、形貌、晶粒尺寸和晶格常数的影响。

【Abstract】 Ternary (Ti. Al)N hard films have been deposited on the high speed steel substrates by DC mngaetron sputtering from a single Ti, Al target. The Ti0·5 Al0·5 N films, with a Bl NaCl structure and a (111) prefered orientation, were found to have a microhardness of 2700 kgf/mm2, a good oxidation resistance and anti-acid corrosion. The influenceof Nitrogen partial pressure, substrate bias and temperature oa microhardness, microstructure, grain size and lattice constant of the films, was discussed in the paper.

  • 【文献出处】 真空科学与技术 ,Vacuum Science and Technology , 编辑部邮箱 ,1990年06期
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