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影响Ar~+激光再结晶多晶硅/二氧化硅界面性质的因素

Effect of Technological Parameters on Ar+ Laser Recrystallized Poly-Si/SiO2 Interface Characteristics

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【作者】 黄信凡; 鲍希茂; 蒋锡平; 文婧; 褚一鸣;

【Author】 Huang Xinfan/Nanjing UniversityBao Ximao/Nanjing UniversityJiang Xipin/Nanjing UniversityWen Jin/Nanjing UniversityChu Yimin/Institute of Semiconductors, Academia Sinica

【机构】 南京大学物理系; 中国科学院半导体研究所;

【摘要】 本文就Ar+激光辐照功率、衬底温度等因素对SOI结构再结晶多晶硅/二氧化硅界面性质的影响进行研究,利用高频和准静态C-V技术测量该界面氧化物固定电荷密度Nt和界面态陷阱密度Nit,用平面和剖面TEM分析再结晶多晶硅膜的结构特性,我们发现当衬底温度为 320℃和420℃时存在一个功率窗口 6.0~6.2W.

【Abstract】 The effect of the power of Ar+ laser irradiation and substrate temperature on the charac-teristics at the interface between recrystallized poly-Si film and laying SiO2 film has been investi-gated.The density of oxide fixed charge Nf and the density of interface traps Nit have beenmeasured by C-V technique both in high frequency and quasi-static state conditions.The TEMtechnique in both plane and cross-section has been used to study the structure properties of re-crystallized poly-Si films.It has been found that the power range of 6.0 W-6.2 W is a powerwindow when the substrate temperature is kept at 320℃ and 420℃.

  • 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1986年06期
  • 【被引频次】2
  • 【下载频次】28
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