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环氧树脂固化反应的DSC研究

Studies on Curing Reaction of Epoxy Resin with DSC

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【作者】 笪有仙; 夏永侠;

【Author】 Da Youxian Xia Yongxia (Institute of Chmistry,Academia Sinica)

【机构】 中国科学院化学研究所; 中国科学院化学研究所;

【摘要】 <正> 环氧树脂在粘接技术与复合材料工业中被大量使用,主要用作胶粘剂和复合材料的基体。环氧树脂是一种热固性材料,它的固化物物理性能除与其组成有关外,还与固化制度选择合理与否有关。因此对固化过程进行研究,不但有理论上的意义,而且有很大的实用价值。

【Abstract】 The curing reaction of Epoxy Re- sin 618 was investigated with D sc and reaction-rate constant,energy of activation,degree of curing and glass- transition temperature (Tg) were obt- ained.It was found that there is a relation between the degree of cur- ing and Tg and that reaction-rate constant k and the temperature ar ~ ~ in good agreement withArrhenlues Equation. There are two caculating methods used to obtain energy of activation. 16.3 kcal/mol and 15.8 kcal/mol obtained by the methods are relatively similar. It was comfirmed that the curing reaction,in the range of studies,obeys first-order reaction.

  • 【文献出处】 粘接 ,Adhesion in China , 编辑部邮箱 ,1985年04期
  • 【被引频次】6
  • 【下载频次】210
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