节点文献
基板负偏压对铜基体磁控溅射离子镀铝膜相组成的影响
The Impact of the Suhstrate’s Negative Bias on the Component Phases of the Magnetron-sputtering Ion-Plating Aluminum Film on Cogper
【摘要】 本文主要论述基板员偏压与铜基体磁控溅射离子镀铝膜的关系。磁控溅射离子镀 铝膜不是简单的单质外接铝膜,而是铜和铝组成的合金膜。膜的相组成主要是由基板 负偏压所决定的。在一定的实验条件下,每一种铜-铝合金相的出现都有一临界负偏压 与之对应.
【Abstract】 This article mainly deals with the relationship between the negative bias of the substrate and the magnetron-sputtering ion plating aluminum film on the co- pper. The magnetron-sputtering ion plating aluminum film is not simply an out- covering layer of a single substance, but an alloy film containing both aluminum and copper. The film’s component phases are primarily decided by the negative bias of the substrate. On the given experimental conditions, the appearance of ev- ery phase of the copper-aluminum alloy will have a corresponding critical negative bias of the substrate.
- 【文献出处】 大连工学院学报 , 编辑部邮箱 ,1985年03期
- 【被引频次】5
- 【下载频次】119