【摘要】 以甲基三氯硅烷、苯基三氯硅烷、二甲基二氯硅烷以及羟基封头的聚二甲基硅氧烷,即HO[（CH₃）₂SiO]_nH,为原料,采用共水解的方法,合成了具有嵌段结构的有机硅树脂。 研究了树脂的结构与抗开裂性能的关系,确定了树脂链段与橡胶链段的克分子比例以及橡胶链段的长度,即n值的大小,该树脂具有优异的抗开裂性能,是一种较好的大功率半导体器件的封装材料。更多还原

【Abstract】 Organosilicon block copolymers were synthesized by co-hydrolysis and condensation of hydroxyl-end-blocked dimethylpolysiloxanes, methyltrichorosilane, phenyltrich-lorosilane and dimethyldichlorosilane. The relationships between resin structures and crack-resistant properties of the plastic were investigated by measuring mechanical loss-temperature spectrum with vibrational reed method. The resin shows optimum crack-resistant properties when R/Si = 1.50, hydroxyl-endblocked dimethylpolysiloxane used is about 23% of the total weight of the resin. The high frequency power transistors encapsulated with this resin show no cracks and have very stable electrical parameters after a series of examination under extreme conditions.更多还原