【摘要】 主要介绍从能量平衡分析来研究HT 7托卡马克等离子体电子的热扩散系数 .研究结果表明 ,HT 7托卡马克等离子体电子的热传导损失是主要的能量损失 ,热对流损失不及欧姆输入功率的 1% ,可以忽略 .电子的反常热扩散系数随半径的增大逐渐增大 ,且比新经典理论预言的大 2个量级 .同时研究了壁处理硅化后的电子热扩散系数 .结果显示 ,硅化后 ,在等离子体外围区域 (r/a >0 .5 )电子的热扩散系数降低 ,从而等离子体能量约束得到改善更多还原

【Abstract】 The electron thermal conductivity in the HT 7 tokamak is obtained by analyzing the electron power balance. In the HT 7 device, the electron thermal convection loss can be neglected, compared with ohmic input power, and the thermal conduction loss is the main energy loss mechanism. The electron thermal diffusion coefficient increases with the minor radius, and is about 100 times larger than the neo classical theory calculation. After siliconization, the electron thermal diffusion coefficient decreases obviously at the outer half region, and the energy confinement time is prolonged.更多还原