【作者】 周亮；

【导师】 杨卓如；

【作者基本信息】 华南理工大学 ， 化学工程， 2003， 博士

【摘要】 在整个涂料工业中，紫外线(UV)固化技术是发展最为迅猛的领域。UV固化技术具有低毒性，原料价格便宜，固化速度快，配方简单和操作方便等诸多优点。本文对光化学、光聚合、光引发剂、光敏树脂、UV固化等的研究进展进行了综述。采用UV固化技术可以使含有不饱和官能团的活性单体、预聚物在光引发剂的作用下进行光聚合反应发生交联。光引发剂主要起到吸收光能，并经过化学变化产生活性中间体的作用。常见的光引发剂可以分为阳离子型和自由基型两大类。 积层印制电路板(简称积层板)是由独立的印制电路板或内层间被绝缘材料分隔的电路板组成。内层的电路依靠普通孔和电镀通孔进行连接。积层板的电路是三维排列的，与传统印制电路板相比极大地节省了空间，因为后者最多只能排布两层电路(即双面板)。积层板微孔的制作方法包括：激光钻孔，光致蚀孔和等离子体蚀孔法。在本研究中采用一种不仅能光致成像，而且能硬化成为永久绝缘材料的UV油墨来形成积层板的内层。 UV油墨可用多种方法涂布，如丝网印刷、静电喷涂、帘涂等。涂布UV油墨后将板进行曝光，再用适当的显影剂显影，将已曝光或未曝光的部分洗掉。显影后进行蚀刻，蚀刻液可以是碱性蚀刻液，或是酸性的氯化铜或氯化亚铜溶液，可将脱去抗蚀层的金属层蚀刻掉。UV油墨，不是在曝光、显影和蚀刻后被剥离，而是作为一种预浸物的补充物或取代物留在内层上，形成内层间的绝缘层。 采用光差扫描量热法(DPC)来监测环氧丙烯酸酯体系的光固化动力学。讨论了反应的影响因素，利用DPC数据计算出反应速率与各种影响因素的关系，光引发剂的浓度指数小于0.5，单体浓度指数介于1和2之间。 环氧丙烯酸(EA)树脂在辐射固化领域中是一种重要的感光树脂，其中双酚A型环氧丙烯酸树脂的应用最为广泛。本文着重研究了该种树脂的合成工艺，讨论了原料投料比、反应温度、催化剂及操作方法等因素对树脂性能的影响，并通过正交试验确定了最佳反应条件。 用N，N-二甲基苯胺作催化剂，合成了酚醛环氧丙烯酸酯。通过酸值和环氧值的测定，研究了反应时间、反应温度、反应物配比及催化剂用量对丙烯酸转化更多还原

【Abstract】 The Ultraviolet (UV) radiation curing technology is one of the most rapidly developing fields in the entire coatings industry. The low toxicity, cheapness, speed, control and ease of formulation and operation are some of the main advantages of this growing technology. In this paper, research progresses of radiation curing materials were reviewed. It included photochemistry, photo radical polymerization, photo initiator, UV curing, photo sensitive resin and reactive monomers. UV curing is used to induce photochemical polymerization or crosslinking of a monomer, prepolymer formulation containing a certain type of unsaturation, such as an acrylic group, and an appropriate initiator. The latter is used to absorb the light energy and transform it into active species, such as radicals or ions, capable of inducing such reactions.Build-up multilayer ( BUM) printed circuit boards comprise a stack of individual printed circuit boards or innerlayers separated by dielectrical material. The circuitry of the several innerlayers is electrically connected by bored and plated-through holes. BUM boards provide circuitry in a three-dimensional array and are therefore advantageously space-saving, relative to conventional printed circuit boards, which provide at most two layers of circuitry on a two-sided board. Available technologies for BUM formation in the dielectric layers include, laser ablation, photovia techniques, plasma etching. The boards to be used as inner layers of a BUM board are formed using a UV ink that is not only photoimageable but is hardenable to form a permanent dielectric material.The UV ink may be applied by a variety of methods such as screen printing, electrostatic spray coating, curtain coating et al. The UV ink is then exposed to radiation and developed in an appropriate developer to remove either the exposed or non-exposed portions of the UV ink. Next, the processed board is subjected to an alkaline etch or an etch with an acidic solution of cupric/cuprous chloride that removes the metal layers from those regions where the UV ink has been removed. The UV ink, rather than being stripped after exposure, development and etching, is left on the inner layers as a supplement or replacement of the prepregs normally used to form dielectric layers between the inner layers.The photocuring process of epoxy acrylate was monitored by differential photocalorimetry(DPC). The curing kinetics were found to be affected by various factors, such as photoinitiator concentration and UV light intensity. The dependence更多还原