【作者】 吴战鹏；

【导师】 金日光； 武德珍；

【作者基本信息】 北京化工大学 ， 材料学， 2006， 博士

【摘要】 聚酰亚胺(PI)/银(Ag)复合薄膜具有质量轻、高反射性、高导电、耐高低温、良好的力学性能、耐老化和可折叠等特点，它在电工、电子、信息、军事、航空和航天等方面具有广阔的应用前景。 本文采用原位一步自金属化法制备了具有高反射、高导电性能的PI/Ag复合薄膜，并系统研究了影响PI/Ag复合薄膜的反射和导电性能的因素。结果表明，提高银含量、选择适当的晾膜时间、选择链段柔韧性较好芳香型PI、合适的固化升温程序和合适的固化环境等都有利于制备出具有高反射、高导电性能的PI/Ag复合薄膜。其中使用BTDA-ODA型芳香型PI，可以制得绝对反射率大于90％、电阻小于0.2Ω的PI/Ag复合薄膜，该复合薄膜保持了母体PI的大部分力学性能。 首次采用PI薄膜改性和原位自金属化法制备出双面具有高反射率和高导电性的PI/Ag复合薄膜。该方法通过使用KOH水溶液对聚酰亚胺薄膜表面处理，使其表面的一层聚酰亚胺结构开环形成聚酰胺酸(此处以盐的形式存在)，然后通过离子交换使目标金属银离子与钾离子进行交换，得到聚酰胺酸与金属银的络合物：通过加热使表面聚酰胺酸环化为聚酰亚胺，同时金属银离子等还原为银原子，并迁移至表面形成银层，从而制得双面具有高反射、高导电的PI/Ag复合薄膜，并通过PI薄膜的选择、碱液处理时间、洗涤时间、银盐溶液的浓度以及处理时间的控制，可以实现对PI/Ag复合薄膜结构和性能的控制。其双面的反射率均大于97％、表面电阻小于0.1欧姆，电磁屏蔽性能大于100分贝(10～10000kMHz)；该制备方法简单、成本低、易于大规模生产。 通过研究几种制备PI/Ag复合薄膜所使用的原材料对银离子还原作用发现，ODA对更多还原

【Abstract】 Flexible silvered polyimide (PI) composite films has been an active area of interest due to their light weight, highly reflectivity and conductivity, excellent thermal stability, wear resistivity, long-term stability and superior mechanical properties. Their uses include electronics, microelectronics, military, aviation and space applications.Reflective and surface conductive flexible silvered polyimide films have been prepared by the in situ self-metallization method. Depending on curing environment, PI structures with flexible chains and groups, and suitable silver concentration, the silvered PI films can be fabricated with high reflectivity, high surface conductivity and outstanding metal-polymer adhesion. By using BTDA-ODA type polyimide, the silvered Films with reflectivity > 90% and surface electrical resistivity less than 0.2Ω/sq were obtained. Mechanical properties of the obtained silvered PI films have retained those of their parent polyimide.A surface modification and in situ self-metallizing procedure have been developed in this study to fabricate silvered PI films with highly reflectivity and conductivity at both sides. The silvered polyimide films have been prepared by potassium hydroxide hydroxylation of polyimide film surface and incorporation of silver ions through subsequent ion exchange. Thermal curing has not only recycloimidized the poly(amic acid) into polyimide, but also reduced silver ions into silver atoms and near-atomic silver clusters, which diffuses and aggregates to give reflective and conductive surfaces without need of the addition of reducing agents. The thickness of silvered layer and the reflectivity and conductivity of the silvered films can be controlled by using suitable kinds of PIs, modification time and temperatures, concentration of aqueous silver nitrate solution and ion exchanging time. By this method, the double-side silvered polyimide films with double side excellent reflective (reflectivity > 97%), conductive surfaces (surface resistivity:0.02 Ω /sq) and outstanding electromagnetic shielding properties (100 dB between10-10000kMHz) can be easily fabricated. Furthermore, their essential mechanical properties can be maintained. This approach demonstrated many advantages, such as lower cost, double-sided reflective and conductive surfaces, excellent mechanical properties, controllable thickness of更多还原