IEEE 1149.1 test standard is becoming widely accepted as a main stream way to overcome the test problem created by complex PCB & MCM.This paper outlines the design of features related to test and then details the Boundary Scan test strategies developed for different MCM.
【正文快照】
1 测试面临微组装技术的挑战MCM( Multi Chip Module.多芯片模块 )技术 ,是将多个裸芯片在多层基板上高密互连的技术 ,被称之为当今新一代电子微组装技术。MCM由于其特有的体积、重量特别是高速与高可靠性优势 ,迅速发展成为国外大型电子系统如MPP的主流封装模式。尤其是在航?