Integrate circuit (IC) is the technology foundation of information industry and a key driving force promoting the development of the high technology. Chemical mechanical polishing (CMP) has been considered as a practical and irreplaceable planarization technology of wafer in IC manufacturing. It is not only the most effective method of achieving ultra-smooth and non-damage surface in manufacturing monocrystalline silicon wafer, but also the ideal method of realizing local and global planarization of wafer i...
| 
点击下列相关研究机构和相关文献作者，可以直接查到这些机构和作者被《中国知识资源总库》收录的其它文献，使您全面了解该机构和该作者的研究动态和历史。
