With the development of aviation, spsceflight, watercraft and electronics, high-performance encapsulating materials were required. It is one of the most important projects to look for a kind of encapsulating materials and research the new methods of preparing it. In this thesis, encapsulating materials of epoxy resin were prepared by using modified acid anhydride prepared ourself as curing agent, HGH,nanostructured SiO_2 modified by organic silicon coupling agent as filler. In the present investigation, the...